Invention Grant
- Patent Title: Die stack structure, semiconductor package having the same and method of manufacturing the same
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Application No.: US16532598Application Date: 2019-08-06
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Publication No.: US10886255B2Publication Date: 2021-01-05
- Inventor: Ji-Seok Hong , Ji-Hoon Kim , Tae-Hun Kim , Hyuek-Jae Lee , Ji-Hwan Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2018-0131220 20181030
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H01L23/48 ; H01L21/56 ; H01L21/822
Abstract:
A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.
Information query
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