公开(公告)号：US20200219853A1

公开(公告)日：2020-07-09

申请号：US16824403

申请日：2020-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US20190096856A1

公开(公告)日：2019-03-28

申请号：US16200109

申请日：2018-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L25/10

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of tire plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US11894346B2

公开(公告)日：2024-02-06

申请号：US18182246

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13025 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/32145 ,  H01L2224/16145 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US11018115B2

公开(公告)日：2021-05-25

申请号：US16824403

申请日：2020-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US11664352B2

公开(公告)日：2023-05-30

申请号：US17329036

申请日：2021-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13025 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/32145 ,  H01L2224/16145 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US10483150B2

公开(公告)日：2019-11-19

申请号：US15349327

申请日：2016-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gun-Ah Lee ,  Ji-Hwan Hwang ,  Cha-Jea Jo ,  Dong-Han Kim ,  Seung-Kon Mok

IPC: H01L21/683 ,  H01L21/67 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00

Abstract: An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.

公开(公告)号：US10153255B2

公开(公告)日：2018-12-11

申请号：US15439321

申请日：2017-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US12183718B2

公开(公告)日：2024-12-31

申请号：US18409778

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji-Hwan Hwang ,  Sang-Sick Park ,  Tae-Hong Min ,  Geol Nam

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.

公开(公告)号：US10886255B2

公开(公告)日：2021-01-05

申请号：US16532598

申请日：2019-08-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Seok Hong ,  Ji-Hoon Kim ,  Tae-Hun Kim ,  Hyuek-Jae Lee ,  Ji-Hwan Hwang

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48 ,  H01L21/56 ,  H01L21/822

Abstract: A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.