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公开(公告)号:US11996016B2
公开(公告)日:2024-05-28
申请号:US18202417
申请日:2023-05-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunyong Choi , Jisu Kim , Hunsung Kim , Boum-Sik Kim , Seungjae Kim , Chul-Yong Cho , Tae-Hun Kim
CPC classification number: G09F9/301 , G06F1/1652 , G06F1/1658
Abstract: A display apparatus includes a display module, a support configured to rotate and support the display module, and a mounting device configured to mount a mobile device on the display module. The mobile device is configured to be paired with the display module. The mounting device includes a mounting portion including a mounting groove having a shape corresponding to a frame forming borders of the display module. The mounting portion is coupled to the frame when the frame is inserted into the mounting groove, and an accommodating portion is positioned below the mounting portion, and accommodates the mobile device such that the mobile device is mounted on the display module.
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2.
公开(公告)号:US10886255B2
公开(公告)日:2021-01-05
申请号:US16532598
申请日:2019-08-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ji-Seok Hong , Ji-Hoon Kim , Tae-Hun Kim , Hyuek-Jae Lee , Ji-Hwan Hwang
IPC: H01L25/065 , H01L23/31 , H01L23/538 , H01L23/00 , H01L23/48 , H01L21/56 , H01L21/822
Abstract: A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.
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公开(公告)号:US20180070596A1
公开(公告)日:2018-03-15
申请号:US15670228
申请日:2017-08-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyoung Mok KIM , Jung Soo Lim , Yu Jeong Oh , Seulkiro Kim , Han Jun Sung , Jae Min Park , Tae-Hun Kim , In Ki Jeon
CPC classification number: A21B3/04 , A47J27/04 , A47J2027/043 , F24C7/087 , F24C14/005 , F24C15/327
Abstract: A cooking appliance including a cleaning environment provided to be able to easily remove contaminants inside the cooking appliance by heating the inside of a cooking room to a temperature for amorphization of the contaminants, and method for controlling the same. The cooking appliance includes a main body configured to have a cooking room; a steam generator configured to supply steam to the cooking room; a water supplier arranged in the main body and configured to store water; and a pump assembly configured to supply water to the steam generator and the cooking room from the water supplier.
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公开(公告)号:USD1022964S1
公开(公告)日:2024-04-16
申请号:US29842875
申请日:2022-06-16
Applicant: Samsung Electronics Co., Ltd.
Designer: Dongwook Kim , Tae-Hun Kim , Gyoosang Choi , Bo-Kyung Seong
Abstract: FIG. 1 is a front perspective view of a remote control showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion in FIG. 2; and,
FIG. 10 is an enlarged view of the encircled portion in FIG. 6.
The evenly-dashed broken lines in the figures depict portions of the remote control which form no part of the claimed design.
The dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.-
公开(公告)号:US10770477B2
公开(公告)日:2020-09-08
申请号:US16401667
申请日:2019-05-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bong-Yong Lee , Tae-Hun Kim , Min-Kyung Bae , Myung-Hun Woo
IPC: H01L29/76 , H01L27/11582 , H01L27/1157 , H01L21/311 , H01L27/11565
Abstract: A vertical semiconductor device includes a plurality of channel connection patterns, a lower insulation layer, a supporting layer, a stacked structure, and a channel structure. The channel connection patterns, on which the lower insulation layer is formed, contact a substrate. The supporting layer is formed on the lower insulation layer to be spaced apart from the channel connection patterns, and includes polysilicon doped with impurities. The stacked structure is formed on the supporting layer, and includes insulation layers and gate electrodes to form a memory cell string. The channel structure passes through the stacked structure, the supporting layer and the lower insulation layer, and includes a charge storage structure and a channel which contacts the channel connection patterns. The charge storage structure and the channel face the gate electrodes and the supporting layer. The supporting layer serves as a gate of a gate induced drain leakage (GIDL) transistor.
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公开(公告)号:USD894141S1
公开(公告)日:2020-08-25
申请号:US29681052
申请日:2019-02-22
Applicant: Samsung Electronics Co., Ltd.
Designer: Hee-Bong Kim , Pilkwon Jung , Gil Jae Lee , Yonggu Do , Tae-Hun Kim
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公开(公告)号:USD989015S1
公开(公告)日:2023-06-13
申请号:US29760402
申请日:2020-12-01
Applicant: Samsung Electronics Co., Ltd.
Designer: Diana Minsun Kang , Jae-Neung Lee , Chul-Yong Cho , Su-An Choi , Tae-Hun Kim
Abstract: FIG. 1 is a front perspective view of a television receiver showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 2;
FIG. 12 is an enlarged view of the delineated portion 12 in FIG. 2;
FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 4;
FIG. 14 is an enlarged view of the delineated portion 14 in FIG. 6;
FIG. 15 is an enlarged view of the delineated portion 15 in FIG. 6;
FIG. 16 is a front perspective view of a television receiver showing our new design in an alternate position;
FIG. 17 is a front elevation view thereof;
FIG. 18 is a rear elevation view thereof;
FIG. 19 is a left side elevation view thereof;
FIG. 20 is a right side elevation view thereof;
FIG. 21 is a top plan view thereof;
FIG. 22 is a bottom plan view thereof;
FIG. 23 is a rear perspective view thereof;
FIG. 24 is an enlarged view of the delineated portion 24 in FIG. 16;
FIG. 25 is an enlarged view of the delineated portion 25 in FIG. 17;
FIG. 26 is an enlarged view of the delineated portion 26 in FIG. 19;
FIG. 27 is an enlarged view of the delineated portion 27 in FIG. 21;
FIG. 28 is an enlarged view of the delineated portion 28 in FIG. 23;
FIG. 29 is an enlarged view of the delineated portion 29 in FIG. 23;
FIG. 30 is a front perspective view of a television receiver showing our new design in an alternate position;
FIG. 31 is a front elevation view thereof;
FIG. 32 is a rear elevation view thereof;
FIG. 33 is a left side elevation view thereof;
FIG. 34 is a right side elevation view thereof;
FIG. 35 is a top plan view thereof;
FIG. 36 is a bottom plan view thereof;
FIG. 37 is a rear perspective view thereof;
FIG. 38 is an enlarged view of the delineated portion 38 in FIG. 30;
FIG. 39 is an enlarged view of the delineated portion 39 in FIG. 30;
FIG. 40 is an enlarged view of the delineated portion 40 in FIG. 31;
FIG. 41 is an enlarged view of the delineated portion 41 in FIG. 35;
FIG. 42 is an enlarged view of the delineated portion 42 in FIG. 37; and,
FIG. 43 is an enlarged view of the delineated portion 43 in FIG. 37.
The evenly dashed broken lines in the drawings illustrate portions of the television receiver that form no part of the claimed design. The dot-dash broken lines in the drawings delineate portions of the claimed design that are illustrated in enlargements and form no part of the claimed design.-
公开(公告)号:USD964951S1
公开(公告)日:2022-09-27
申请号:US29760853
申请日:2020-12-04
Applicant: Samsung Electronics Co., Ltd.
Designer: Diana Minsun Kang , Jae-Neung Lee , Chul-Yong Cho , Su-An Choi , Tae-Hun Kim
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公开(公告)号:US10904960B2
公开(公告)日:2021-01-26
申请号:US15860230
申请日:2018-01-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tae-Hun Kim , Jong-Hoon Lee , Woo Joo Kim , In Ki Jeon , Seong Joo Cho , Kun-Woo Choi
Abstract: Disclosed herein are a lamp module that includes a double insulation structure and a cooling structure, thus being usable even in a high temperature condition, and a cooking appliance including the same. The cooking appliance includes a cooking compartment, a cooling fan disposed at an upper portion of the cooking compartment to suction outside air, and a lamp module configured to illuminate an inside of the cooking compartment and disposed adjacent to the cooling fan to exchange heat with the outside air suctioned by the cooling fan.
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公开(公告)号:US09391238B2
公开(公告)日:2016-07-12
申请号:US14145153
申请日:2013-12-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tae-Hun Kim , Seung-Hwan Lee
CPC classification number: H01L33/38 , H01L33/20 , H01L33/22 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
Abstract: A semiconductor light-emitting device includes a light-emitting structure that includes a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, an electrode layer contacting one of the first conductive semiconductor layer and the second conductive semiconductor layer, and a bonding conductive layer connected to the electrode layer. The bonding conductive layer includes a main bonding layer having a recess area defined by a stepped portion on a surface opposite to a surface facing the electrode layer, and a filling bonding layer filling at least a part of the recess area.
Abstract translation: 半导体发光器件包括发光结构,其包括第一导电半导体层,有源层,第二导电半导体层,接触第一导电半导体层和第二导电半导体层之一的电极层,以及 连接到电极层的导电层。 接合导电层包括主接合层,其具有由与面向电极层的表面相对的表面上的阶梯部分限定的凹部区域,以及填充凹部区域的至少一部分的填充接合层。
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