Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US16733989Application Date: 2020-01-03
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Publication No.: US10896998B2Publication Date: 2021-01-19
- Inventor: Tadao Hayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JP2016-205208 20161019
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/54 ; H01L33/48 ; H01L33/60 ; H01L33/64 ; H01L33/62

Abstract:
A method of manufacturing a light emitting device includes: providing a light emitting element including a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface; providing a covering member including a lens portion and a first recess on a side different from the lens portion; disposing the light emitting element on a bottom surface of the first recess, with the light extraction surface and the bottom surface of the first recess facing each other; and forming a reflective member in the first recess to cover the lateral surfaces of the light emitting element while at least a part of the pair of electrodes is exposed from the reflective member.
Information query
IPC分类: