- Patent Title: Methods for producing nanowire stack GAA device with inner spacer
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Application No.: US16598275Application Date: 2019-10-10
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Publication No.: US10930498B2Publication Date: 2021-02-23
- Inventor: Tzu-Chung Wang , Chao-Ching Cheng , Tzu-Chiang Chen , Tung Ying Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/02 ; H01L29/06 ; H01L29/10 ; H01L29/08 ; H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L29/775 ; H01L21/8238 ; H01L21/8234

Abstract:
The current disclosure describes techniques for forming a low resistance junction between a source/drain region and a nanowire channel region in a gate-all-around FET device. A semiconductor structure includes a substrate, multiple separate semiconductor nanowire strips vertically stacked over the substrate, a semiconductor epitaxy region adjacent to and laterally contacting each of the multiple separate semiconductor nanowire strips, a gate structure at least partially over the multiple separate semiconductor nanowire strips, and a dielectric structure laterally positioned between the semiconductor epitaxy region and the gate structure. The first dielectric structure has a hat-shaped profile.
Public/Granted literature
- US20200075718A1 Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same Public/Granted day:2020-03-05
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