Invention Grant
- Patent Title: Panel to be plated, electroplating process using the same, and chip manufactured from the same
-
Application No.: US16447358Application Date: 2019-06-20
-
Publication No.: US10941498B2Publication Date: 2021-03-09
- Inventor: Chien-Hsun Chu , Chien-Chou Tseng , Ming-Huan Yang , Tai-Jui Wang , Yu-Hua Chung , Chieh-Wei Feng
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW10714684.6 20181224
- Main IPC: H01L29/40
- IPC: H01L29/40 ; C25D5/02 ; C25D7/12 ; H01L23/528 ; H01L21/288
Abstract:
A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.
Public/Granted literature
- US20200063282A1 PANEL TO BE PLATED, ELECTROPLATING PROCESS USING THE SAME, AND CHIP MANUFACTURED FROM THE SAME Public/Granted day:2020-02-27
Information query
IPC分类:
