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1.发明授权公开(公告)号：US10941498B2
公开(公告)日：2021-03-09
申请号：US16447358
申请日：2019-06-20
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chien-Hsun Chu , Chien-Chou Tseng , Ming-Huan Yang , Tai-Jui Wang , Yu-Hua Chung , Chieh-Wei Feng
IPC: H01L29/40 , C25D5/02 , C25D7/12 , H01L23/528 , H01L21/288
Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.
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公开(公告)号：US12211811B2
公开(公告)日：2025-01-28
申请号：US17702812
申请日：2022-03-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Ming Peng , Chien-Chou Tseng , Chih-Chia Chang , Kuan-Chu Wu , Yu-Lin Hsu
Abstract: An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.
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公开(公告)号：US20230154877A1
公开(公告)日：2023-05-18
申请号：US17702812
申请日：2022-03-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Ming Peng , Chien-Chou Tseng , Chih-Chia Chang , Kuan-Chu Wu , Yu-Lin Hsu
CPC classification number: H01L24/06 , H01L33/62 , H01L24/05 , H01L23/13 , H01L24/08 , H01L24/16 , H01L24/80 , H01L24/81 , H01L22/20 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05686 , H01L2924/0549 , H01L2224/0569 , H01L2224/05693 , H01L24/13 , H01L2224/13186 , H01L2224/1319 , H01L2224/13193 , H01L2224/0603 , H01L2224/08238 , H01L2224/16227 , H01L2224/80411 , H01L2224/80424 , H01L2224/80439 , H01L2224/80444 , H01L2224/80447 , H01L2224/80455 , H01L2224/80486 , H01L2224/8049 , H01L2224/80493 , H01L2224/81411 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81191 , H01L2224/81192 , H01L23/145
Abstract: An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.
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