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    Weight training method, apparatus and system
    2.
    发明授权
    Weight training method, apparatus and system 有权

    公开(公告)号：US11305157B2

    公开(公告)日：2022-04-19

    申请号：US16745369

    申请日：2020-01-17

    Applicant: Industrial Technology Research Institute

    Inventor： Tzu-Hao Yu ,  Tzu-Yang Ting ,  Yun-Yi Huang ,  Chien-Hsun Chu

    IPC: A63B24/00 ,  A61B5/11

    Abstract: A weight training method, a weight training apparatus and a weight training system are provided. In the method, a weight of a load of a user operating the weight training apparatus is detected by a load sensor, a motion of the load is detected by an activity sensor, and thereby an operation power of the weight training apparatus is calculated. A force applied by the muscle portion when the user operates the weight training apparatus is detected by at least one biophysical quantity sensor disposed on at least one muscle portion of the user and used to calculate an energy power consumed by the user. An exercise efficiency value of the user is calculated by using the energy power and the operation power, and the user is prompted to adjust an operation performed on the weight training apparatus when the exercise efficiency value drops beyond a preset ratio.

    Redistribution structure and forming method thereof
    3.
    发明授权
    Redistribution structure and forming method thereof 有权

    公开(公告)号：US11251115B1

    公开(公告)日：2022-02-15

    申请号：US17144144

    申请日：2021-01-08

    Applicant: Industrial Technology Research Institute

    Inventor： Shao-An Yan ,  Chieh-Wei Feng ,  Tzu-Yang Ting ,  Tzu-Hao Yu ,  Chien-Hsun Chu ,  Jui-Wen Yang ,  Hsin-Cheng Lai

    IPC: H01L23/498 ,  H01L21/48 ,  G06F30/3308 ,  G06F119/18

    Abstract: A redistribution structure including a first redistribution layer is provided. The first redistribution layer includes a dielectric layer; at least one conductive structure located in the dielectric layer, wherein the at least one conductive structure has a width L; and at least one dummy structure located adjacent to the at least one conductive structure and located in the dielectric layer, and the at least one dummy structure has a width D, wherein there is a gap width S between the at least one dummy structure and the at least one conductive structure, and a degree of planarization DOP of the first redistribution layer is greater than or equal to 95%, wherein DOP=[1−(h/T)]*100%, and h refers to a difference between a highest height and a lowest height of a top surface of the dielectric layer; and T refers to a thickness of the at least one conductive structure.

    THIN FILM DEFORMATION ELEMENT AND MULTI-TACTILE FEEDBACK COMPONENT
    4.
    发明申请
    THIN FILM DEFORMATION ELEMENT AND MULTI-TACTILE FEEDBACK COMPONENT 有权

    公开(公告)号：US20250073752A1

    公开(公告)日：2025-03-06

    申请号：US18818608

    申请日：2024-08-29

    Applicant: Industrial Technology Research Institute

    Inventor： Chen-Tsai Yang ,  Chih-Cheng Cheng ,  Wan-Hsin Chen ,  Chien-Hsun Chu ,  Li-Wei Yao

    IPC: B06B1/06 ,  G08B6/00

    Abstract: A multi-tactile feedback component is suitable for an electronic device and includes a thin film deformation element, a thin film vibration element, and a power module. The thin film deformation element has first and second elastic layers and a gain layer disposed therebetween and forming a channel to accommodate a fluid. The thin film vibration element is connected to the thin film deformation element and has a piezoelectric layer and tactile structures. The tactile structures are disposed at a side surface of the piezoelectric layer. The power module is coupled to the thin film deformation element and the thin film vibration element. When the power module supplies an electrical energy to the thin film deformation element, the first elastic layer is deformed to push the fluid and the second elastic layer. When the power module supplies the electrical energy to the thin film vibration element, the piezoelectric layer vibrates.

    WEIGHT TRAINING METHOD, APPARATUS AND SYSTEM
    6.
    发明申请
    WEIGHT TRAINING METHOD, APPARATUS AND SYSTEM 有权

    公开(公告)号：US20210023416A1

    公开(公告)日：2021-01-28

    申请号：US16745369

    申请日：2020-01-17

    Applicant: Industrial Technology Research Institute

    Inventor： Tzu-Hao Yu ,  Tzu-Yang Ting ,  Yun-Yi Huang ,  Chien-Hsun Chu

    IPC: A63B24/00 ,  A61B5/11

    Abstract: A weight training method, a weight training apparatus and a weight training system are provided. In the method, a weight of a load of a user operating the weight training apparatus is detected by a load sensor, a motion of the load is detected by an activity sensor, and thereby an operation power of the weight training apparatus is calculated. A force applied by the muscle portion when the user operates the weight training apparatus is detected by at least one biophysical quantity sensor disposed on at least one muscle portion of the user and used to calculate an energy power consumed by the user. An exercise efficiency value of the user is calculated by using the energy power and the operation power, and the user is prompted to adjust an operation performed on the weight training apparatus when the exercise efficiency value drops beyond a preset ratio.

    FLEXIBLE ELECTRONIC DEVICE
    7.
    发明公开
    FLEXIBLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240341653A1

    公开(公告)日：2024-10-17

    申请号：US18420789

    申请日：2024-01-24

    Applicant: Industrial Technology Research Institute

    Inventor： Min-Hsiung Liang ,  Chien-Hsun Chu ,  Kuan-Chu Wu ,  Wan-Chen Yang ,  Jui-Chang Chuang ,  Chen-Tsai Yang ,  Heng-Yin Chen ,  Hung-Hsien Ko

    IPC: A61B5/263

    CPC classification number: A61B5/263 ,  A61B2562/164 ,  A61B2562/18

    Abstract: A flexible electronic device includes a first encapsulation layer and a sensing structure. The sensing structure is disposed on the first encapsulation layer and includes a substrate, a plurality of first sensing layer, a plurality of second sensing layer, a first groove and a second groove. The substrate includes a main body, a plurality of first branches and a plurality of second branches. The main body has a first side and a second side opposite to each other. The first branches connect the first side. The second branches connect the second side. The first sensing layers are disposed on the first branches. The second sensing layers are disposed on the second branches. The first groove is disposed between the first branches. The second groove is disposed between the second branches.

    REDISTRIBUTION STRUCTURE AND FORMING METHOD THEREOF
    8.
    发明申请
    REDISTRIBUTION STRUCTURE AND FORMING METHOD THEREOF 有权

    公开(公告)号：US20220130744A1

    公开(公告)日：2022-04-28

    申请号：US17159012

    申请日：2021-01-26

    Applicant: Industrial Technology Research Institute

    Inventor： Shu-Wei Kuo ,  Chen-Tsai Yang ,  Wei-Yuan Cheng ,  Chien-Hsun Chu ,  Shau-Fei Cheng

    IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

    Abstract: Provided is a forming method of a redistribution structure including: forming a first redistribution layer and a first compensation circuit layer on a substrate, wherein the first compensation circuit layer surrounds the first redistribution layer, and the first compensation circuit layer and the first redistribution layer are electrically insulated from each other; forming a first dielectric layer on the first redistribution layer and the first compensation circuit layer; and forming a second redistribution layer and a second compensation circuit layer on the first dielectric layer, wherein the second compensation circuit layer surrounds the second redistribution layer, the second compensation circuit layer and the second redistribution layer are electrically insulated from each other, the second compensation circuit layer is connected to the first compensation circuit layer, and the second redistribution layer is connected to the first redistribution layer.

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