Invention Grant
- Patent Title: Programmable redistribution die
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Application No.: US16469100Application Date: 2017-11-29
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Publication No.: US10943864B2Publication Date: 2021-03-09
- Inventor: Eng Huat Goh , Min Suet Lim , J-Wing Teh , Bok Eng Cheah
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2016704869 20161229
- International Application: PCT/US2017/063727 WO 20171129
- International Announcement: WO2018/125493 WO 20180705
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L23/48 ; H01L23/00 ; H01L25/00 ; H01L27/02
Abstract:
A device and method of utilizing a programmable redistribution die to redistribute the outputs of semiconductor dies. Integrated circuit packages using a programmable redistribution die are shown. Methods of creating a programmable redistribution die are shown.
Public/Granted literature
- US20200083157A1 PROGRAMMABLE REDISTRIBUTION DIE Public/Granted day:2020-03-12
Information query
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