公开(公告)号：US20220337248A1

公开(公告)日：2022-10-20

申请号：US17856768

申请日：2022-07-01

Applicant: Intel Corporation

Inventor： J-Wing Teh ,  Min Suet Lim ,  Lai Guan Tang ,  MD Altaf Hossain ,  Gregory Steinke

IPC: H03K19/17736 ,  H01L25/065 ,  H01L23/538 ,  H01L25/18

Abstract: Systems, methods, and devices are provided for configurable die-to-die communication between dies of an integrated circuit system using a programmable routing bridge. Such an integrated circuit system may include a first die on a substrate, a second die on the substrate, and a programmable routing bridge embedded in the substrate. The programmable routing bridge may be mounted to the first die and the second die and is configurable to transfer data between selectable points of the first die and selectable points of the second die.

公开(公告)号：US10943864B2

公开(公告)日：2021-03-09

申请号：US16469100

申请日：2017-11-29

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Min Suet Lim ,  J-Wing Teh ,  Bok Eng Cheah

IPC: H01L23/525 ,  H01L23/48 ,  H01L23/00 ,  H01L25/00 ,  H01L27/02

Abstract: A device and method of utilizing a programmable redistribution die to redistribute the outputs of semiconductor dies. Integrated circuit packages using a programmable redistribution die are shown. Methods of creating a programmable redistribution die are shown.

公开(公告)号：US20200083157A1

公开(公告)日：2020-03-12

申请号：US16469100

申请日：2017-11-29

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Min Suet Lim ,  J-Wing Teh ,  Bok Eng Cheah

IPC: H01L23/525 ,  H01L23/48 ,  H01L25/00 ,  H01L23/00 ,  H01L27/02

Abstract: A device and method of utilizing a programmable redistribution die to redistribute the outputs of semiconductor dies. Integrated circuit packages using a programmable redistribution die are shown. Methods of creating a programmable redistribution die are shown.