Invention Grant
- Patent Title: Heat transmissive optoelectronic component and module
-
Application No.: US16066552Application Date: 2017-01-10
-
Publication No.: US10944033B2Publication Date: 2021-03-09
- Inventor: Luca Haiberger , David Racz , Matthias Sperl
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: DE102016100320.4 20160111
- International Application: PCT/EP2017/050407 WO 20170110
- International Announcement: WO2017/121725 WO 20170720
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/62 ; H01L31/024 ; H01L33/64 ; H01L31/0224 ; H01L31/02 ; H01L33/38 ; H01L33/54 ; H01L31/0304 ; H01L31/0352 ; H01L33/06 ; H01L33/30

Abstract:
An optoelectronic component includes a radiation side, a contact side opposite a radiation side with at least two electrically conductive contact elements for external electrical contacting of the component, and a semiconductor layer sequence arranged between the radiation side and the contact side with an active layer that emits or absorbs electromagnetic radiation during normal operation, wherein the contact elements are spaced apart from each other at the contact side and are completely or partially exposed at the contact side in the unmounted state of the component, the region of the contact side between the contact elements is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in plan view of the contact side the cooling element covers one or both contact elements partially.
Public/Granted literature
- US20190013451A1 OPTOELECTRONIC COMPONENT, OPTOELECTRONIC MODULE, AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT Public/Granted day:2019-01-10
Information query
IPC分类: