Invention Grant
- Patent Title: Substrate processing apparatus and apparatus for manufacturing integrated circuit device
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Application No.: US15827144Application Date: 2017-11-30
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Publication No.: US10985036B2Publication Date: 2021-04-20
- Inventor: Young-Hoo Kim , Sang-Jine Park , Yong-Jhin Cho , Yeon-Jin Gil , Ji-Hoon Jeong , Byung-Kwon Cho , Yong-Sun Ko , Kun-Tack Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2017-0071729 20170608
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/02
Abstract:
A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
Public/Granted literature
- US20180358242A1 Substrate Processing Apparatus and Apparatus for Manufacturing Integrated Circuit Device Public/Granted day:2018-12-13
Information query
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