Invention Grant
- Patent Title: Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices
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Application No.: US15087120Application Date: 2016-03-31
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Publication No.: US11000915B2Publication Date: 2021-05-11
- Inventor: John Charles Ehmke , Simon Joshua Jacobs
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Brian D. Graham; Charles A. Brill; Frank D. Cimino
- Main IPC: B23K20/02
- IPC: B23K20/02 ; B23K20/16 ; C25D5/12 ; B23K20/233 ; B23K20/24 ; C25D5/50 ; C25D7/12 ; C25D5/10 ; C25D5/14 ; B81C1/00 ; B23K35/30 ; B23K101/42

Abstract:
In described examples, a transient liquid phase (TLP) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (Ra) of between about 0.001 to 500 nm. Also, the TLP metal bonding material includes a first terminal metal layer that forms an external surface of the TLP metal bonding material. A metal fuse layer is positioned between the base metal layer and the first terminal metal layer. The TLP metal bonding material is stable at room temperature for at least a predetermined period of time.
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