- 专利标题: Laser machining device
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申请号: US16167559申请日: 2018-10-23
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公开(公告)号: US11000918B2公开(公告)日: 2021-05-11
- 发明人: Mamoru Idaka , Masaki Saito , Hideki Yamakawa , Kazuyoshi Ogawa
- 申请人: Keyence Corporation
- 申请人地址: JP Osaka
- 专利权人: Keyence Corporation
- 当前专利权人: Keyence Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Kilyk & Bowersox, P.L.L.C.
- 优先权: JPJP2017-239911 20171214
- 主分类号: B23K26/06
- IPC分类号: B23K26/06 ; B23K26/082 ; H01S3/0941 ; H01S3/02 ; B23K26/03 ; B23K26/042 ; B23K26/38 ; B23K26/352 ; G02F1/35 ; H01S3/102 ; B23K26/046 ; B23K26/0622 ; B23K26/064 ; H01S3/04 ; H01S3/23 ; H01S3/16 ; H01S3/10 ; H01S3/109 ; H01S3/00 ; H01S3/11 ; H01S3/081
摘要:
To prevent an output decrease of laser light due to impurities that could be formed in a guide-light emitting device or an imaging device. A laser-light guiding section includes a transmission window section, an optical component disposed to cause an optical path of the UV laser light emitted from the laser-light output section and an optical path of transmitted light transmitted through the transmission window section to cross, and a sealing member in which the transmission window section is provided, the sealing member configuring a sealed space for airtightly housing the optical component. At least one of a guide-light emitting device configured to emit guide light for visualizing a scanning position of the UV laser light toward the transmission window section and an imaging device configured to receive light for imaging a workpiece via the transmission window section is disposed on the outer side of the sealed space.
公开/授权文献
- US20190184491A1 Laser Machining Device 公开/授权日:2019-06-20
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