Invention Grant
- Patent Title: Extreme ultraviolet (EUV) mask for lithography and associated methods
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Application No.: US16001213Application Date: 2018-06-06
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Publication No.: US11054736B2Publication Date: 2021-07-06
- Inventor: Woon-hyuk Choi , No-young Chung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, PC
- Priority: KR10-2017-0160998 20171128
- Main IPC: G03F1/36
- IPC: G03F1/36 ; G03F7/20 ; G03F1/70 ; G03F1/22 ; G03F1/24

Abstract:
A method of manufacturing an extreme ultraviolet (EUV) mask, for use in an EUV exposure process, on a mask substrate includes constructing a first monitoring macro considering an effect caused by a slit used in the EUV exposure process, performing an optical proximity correction (OPC) using a plurality of second monitoring macros, wherein each of the plurality of second monitoring macros is substantially identical to the first monitoring macro, inputting mask tape-out (MTO) design data acquired through the OPC, preparing mask data including at least one of data format conversion, mask process correction (MPC), and job-deck for the MTO design data, and performing EUV exposure (writing) on the mask substrate based on the mask data.
Public/Granted literature
- US20190163048A1 EXTREME ULTRAVIOLET (EUV) MASK FOR LITHOGRAPHY AND ASSOCIATED METHODS Public/Granted day:2019-05-30
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