Invention Grant
- Patent Title: Silicon carbide semiconductor component with edge termination structure
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Application No.: US16197151Application Date: 2018-11-20
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Publication No.: US11145755B2Publication Date: 2021-10-12
- Inventor: Larissa Wehrhahn-Kilian , Rudolf Elpelt , Roland Rupp , Ralf Siemieniec , Bernd Zippelius
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102017127848.6 20171124
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/16 ; H01L29/08 ; H01L29/417 ; H01L29/06 ; H01L29/861 ; H01L29/739 ; H01L21/04 ; H01L29/66

Abstract:
A semiconductor component includes a SiC semiconductor body having an active region and an edge termination structure at least partly surrounding the active region. A drift zone of a first conductivity type is formed in the SiC semiconductor body. The edge termination structure includes: a first doped region of a second conductivity type between a first surface of the SiC semiconductor body and the drift zone, the first doped region at least partly surrounding the active region and being spaced apart from the first surface; a plurality of second doped regions of the second conductivity type between the first surface and the first doped region; and third doped regions of the first conductivity type separating adjacent second doped regions of the plurality of second doped regions from one another in a lateral direction.
Public/Granted literature
- US20190165159A1 Silicon Carbide Semiconductor Component with Edge Termination Structure Public/Granted day:2019-05-30
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