Invention Grant
- Patent Title: Embedded die package multichip module
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Application No.: US16028741Application Date: 2018-07-06
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Publication No.: US11158595B2Publication Date: 2021-10-26
- Inventor: Woochan Kim , Masamitsu Matsuura , Mutsumi Masumoto , Kengo Aoya , Hau Thanh Nguyen , Vivek Kishorechand Arora , Anindya Poddar
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L23/532 ; H01L21/56 ; H01L23/31 ; H01L25/00 ; H01L23/29 ; H01L23/528 ; H01L23/522 ; H01L23/538 ; H01L23/433 ; H01L23/367

Abstract:
An embedded die package includes a first die having an operating voltage between a first voltage potential and a second voltage potential that is less than the first voltage potential. A via, including a conductive material, is electrically connected to a bond pad on a surface of the first die, the via including at least one extension perpendicular to a plane along a length of the via. A redistribution layer (RDL) is electrically connected to the via, at an angle with respect to the via defining a space between the surface and a surface of the RDL. A build-up material is in the space.
Public/Granted literature
- US20190013288A1 EMBEDDED DIE PACKAGE MULTICHIP MODULE Public/Granted day:2019-01-10
Information query
IPC分类: