发明授权
- 专利标题: Memory device
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申请号: US16914296申请日: 2020-06-27
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公开(公告)号: US11171284B2公开(公告)日: 2021-11-09
- 发明人: Wei-Hao Liao , Chih-Wei Lu , Hsi-Wen Tien , Pin-Ren Dai , Chung-Ju Lee
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Maschoff Brennan
- 主分类号: H01L43/02
- IPC分类号: H01L43/02 ; H01L27/22 ; H01L43/12 ; H01L43/08
摘要:
A memory device includes a bottom electrode, an MTJ stack, and a top electrode. The bottom electrode has a lower sidewall and an upper sidewall above the lower sidewall and laterally set back from the lower sidewall. The MTJ stack is over the bottom electrode. The MTJ stack includes a bottom magnetic layer, a tunnel barrier layer over the bottom magnetic layer and a top magnetic layer over the tunnel barrier layer. The bottom magnetic layer has a sidewall coterminous with the upper sidewall of the bottom electrode. The top magnetic layer has a sidewall laterally set back from the upper sidewall of the bottom electrode. The top electrode is over the MTJ stack.
公开/授权文献
- US20200328343A1 MEMORY DEVICE AND FABRICATION METHOD THEREOF 公开/授权日:2020-10-15
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