Invention Grant
- Patent Title: Memory device
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Application No.: US16914296Application Date: 2020-06-27
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Publication No.: US11171284B2Publication Date: 2021-11-09
- Inventor: Wei-Hao Liao , Chih-Wei Lu , Hsi-Wen Tien , Pin-Ren Dai , Chung-Ju Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L27/22 ; H01L43/12 ; H01L43/08

Abstract:
A memory device includes a bottom electrode, an MTJ stack, and a top electrode. The bottom electrode has a lower sidewall and an upper sidewall above the lower sidewall and laterally set back from the lower sidewall. The MTJ stack is over the bottom electrode. The MTJ stack includes a bottom magnetic layer, a tunnel barrier layer over the bottom magnetic layer and a top magnetic layer over the tunnel barrier layer. The bottom magnetic layer has a sidewall coterminous with the upper sidewall of the bottom electrode. The top magnetic layer has a sidewall laterally set back from the upper sidewall of the bottom electrode. The top electrode is over the MTJ stack.
Public/Granted literature
- US20200328343A1 MEMORY DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2020-10-15
Information query
IPC分类: