Invention Grant
- Patent Title: Direct liquid injection system for thin film deposition
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Application No.: US16546170Application Date: 2019-08-20
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Publication No.: US11180849B2Publication Date: 2021-11-23
- Inventor: Subramanya P. Herle , Vicente M. Lim , Basavaraj Pattanshetty , Ajay More , Marco Mohr , Bjoern Sticksel-Weis , Nilesh Chimanrao Bagul , Visweswaren Sivaramakrishnan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/448 ; C23C14/24 ; C23C16/50 ; C23C14/08

Abstract:
An apparatus for direct liquid injection (DLI) of chemical precursors into a processing chamber is provided. The apparatus includes a vaporizer assembly having an injection valve for receiving a liquid reactant, vaporizing the liquid reactant, and delivering the vaporized liquid reactant. The injection valve includes a valve body encompassing an interior region therein, a gas inlet port, a liquid inlet port, and a vapor outlet port all in fluid communication with the interior region. The vaporizer assembly further includes a first inlet line having a first end fluidly coupled with the liquid inlet port and a second end to be connected to a liquid source. The vaporizer assembly further includes a second inlet line with a first end fluidly coupled with the gas inlet port, a second end fluidly coupled with a carrier gas source, and a heater positioned between the first end and the second end.
Public/Granted literature
- US20200071820A1 DIRECT LIQUID INJECTION SYSTEM FOR THIN FILM DEPOSITION Public/Granted day:2020-03-05
Information query
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