Invention Grant
- Patent Title: Composites with enhanced thermal conductivity and method preparing the same
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Application No.: US16538831Application Date: 2019-08-13
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Publication No.: US11186776B2Publication Date: 2021-11-30
- Inventor: Hong Jin Lim , Nam Ho You , Seokhoon Ahn , Munju Goh , Se Gyu Jang , Myung Jong Kim
- Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul
- Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Seoul
- Agency: Cantor Colburn LLP
- Priority: KR10-2018-0096187 20180817
- Main IPC: C09K19/38
- IPC: C09K19/38 ; C08K3/013 ; C08K3/14 ; C08K3/22 ; C08K3/28 ; C08L63/00
Abstract:
The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.
Public/Granted literature
- US20200056094A1 COMPOSITES WITH ENHANCED THERMAL CONDUCTIVITY AND METHOD PREPARING THE SAME Public/Granted day:2020-02-20
Information query
