Invention Grant
- Patent Title: Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
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Application No.: US16094381Application Date: 2016-04-27
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Publication No.: US11264250B2Publication Date: 2022-03-01
- Inventor: Robert Reichardt , Max Siebert , Yongqing Lan , Michael Lauter , Sheik Ansar Usman Ibrahim , Reza M Golzarian , Haci Osman Guevenc , Julian Proelss , Leonardus Leunissen
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Agency: Faegre Drinker Biddle & Reath LLP
- International Application: PCT/EP2016/059363 WO 20160427
- International Announcement: WO2017/186283 WO 20171102
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321 ; C09K3/14
Abstract:
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an anionic surfactant of the general formula (I) R-S wherein R is C5-C20-alkyl, C5-C20-alkenyl, C5-C20-alkylacyl or C5-C20-alkenylacyl and S is a sulfonic acid derivative, an amino acid derivative or a phosphoric acid derivative or salts or mixtures thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.
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