Invention Grant
- Patent Title: Nitride-free spacer or oxide spacer for embedded flash memory
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Application No.: US16950144Application Date: 2020-11-17
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Publication No.: US11264400B2Publication Date: 2022-03-01
- Inventor: Wei Cheng Wu , Jui-Tsung Lien
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/1157
- IPC: H01L27/1157 ; H01L21/28 ; H01L27/11568 ; H01L29/423 ; H01L29/66 ; H01L29/792

Abstract:
In some embodiments, a semiconductor substrate includes first and second source/drain regions which are separated from one another by a channel region. The channel region includes a first portion adjacent to the first source/drain region and a second portion adjacent the second source/drain region. A select gate is spaced over the first portion of the channel region and is separated from the first portion of the channel region by a select gate dielectric. A memory gate is spaced over the second portion of the channel region and is separated from the second portion of the channel region by a charge-trapping dielectric structure. The charge-trapping dielectric structure extends upwardly alongside the memory gate to separate neighboring sidewalls of the select gate and memory gate from one another. An oxide spacer or nitride-free spacer is arranged in a sidewall recess of the charge-trapping dielectric structure nearest the second source/drain region.
Public/Granted literature
- US20210074712A1 NITRIDE-FREE SPACER OR OXIDE SPACER FOR EMBEDDED FLASH MEMORY Public/Granted day:2021-03-11
Information query
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