Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16803278Application Date: 2020-02-27
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Publication No.: US11264502B2Publication Date: 2022-03-01
- Inventor: Jung-Hung Chang , Lo-Heng Chang , Zhi-Chang Lin , Shih-Cheng Chen , Kuo-Cheng Chiang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L27/092 ; H01L29/66 ; H01L21/28 ; H01L21/8238 ; H01L29/78 ; H01L21/308 ; H01L29/06 ; H01L29/10 ; H01L29/423 ; H01L29/786 ; H01L21/02 ; H01L21/311

Abstract:
A method of independently forming source/drain regions in NMOS regions including nanosheet field-effect transistors (NSFETs), NMOS regions including fin field-effect transistors (FinFETs) PMOS regions including NSFETs, and PMOS regions including FinFETs and semiconductor devices formed by the method are disclosed. In an embodiment, a device includes a semiconductor substrate; a first nanostructure over the semiconductor substrate; a first epitaxial source/drain region adjacent the first nanostructure; a first inner spacer layer adjacent the first epitaxial source/drain region, the first inner spacer layer comprising a first material; a second nanostructure over the semiconductor substrate; a second epitaxial source/drain region adjacent the second nanostructure; and a second inner spacer layer adjacent the second epitaxial source/drain region, the second inner spacer layer comprising a second material different from the first material.
Public/Granted literature
- US20210273098A1 Semiconductor Device and Method Public/Granted day:2021-09-02
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