Invention Grant
- Patent Title: FinFETs with low source/drain contact resistance
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Application No.: US16910662Application Date: 2020-06-24
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Publication No.: US11271095B2Publication Date: 2022-03-08
- Inventor: Yu-Lien Huang , Tung Ying Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/311 ; H01L29/78 ; H01L21/768 ; H01L21/285 ; H01L21/306 ; H01L21/8234 ; H01L27/088 ; H01L29/45

Abstract:
An integrated circuit structure includes a semiconductor substrate, insulation regions extending into the semiconductor substrate, with the insulation regions including first top surfaces and second top surfaces lower than the first top surfaces, a semiconductor fin over the first top surfaces of the insulation regions, a gate stack on a top surface and sidewalls of the semiconductor fin, and a source/drain region on a side of the gate stack. The source/drain region includes a first portion having opposite sidewalls that are substantially parallel to each other, with the first portion being lower than the first top surfaces and higher than the second top surfaces of the insulation regions, and a second portion over the first portion, with the second portion being wider than the first portion.
Public/Granted literature
- US20200328291A1 FinFETs with Low Source/Drain Contact Resistance Public/Granted day:2020-10-15
Information query
IPC分类: