Invention Grant
- Patent Title: Devices and methods having magnetic shielding layer
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Application No.: US16711152Application Date: 2019-12-11
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Publication No.: US11276649B2Publication Date: 2022-03-15
- Inventor: Harry-Hak-Lay Chuang , Tien-Wei Chiang , Chia-Hsiang Chen , Meng-Chun Shih , Ching-Huang Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H05K9/00 ; H01L43/02

Abstract:
Devices and methods are provided in which a magnetic sensitive semiconductor chip, such as a magnetoresistive random-access memory (MRAM) chip, is shielded from magnetic interference by a magnetic shielding layer. A device includes a housing that defines an exterior surface. A semiconductor chip is disposed within the housing, and the semiconductor chip is spaced apart from the exterior surface of the housing. A magnetic shielding layer is spaced apart from the semiconductor chip by a distance less than 5 mm.
Information query
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