Invention Grant
- Patent Title: Package structure and manufacturing method thereof
-
Application No.: US16805869Application Date: 2020-03-02
-
Publication No.: US11289398B2Publication Date: 2022-03-29
- Inventor: Shih-Hui Wang , Der-Chyang Yeh , Shih-Peng Tai , Tsung-Shu Lin , Yi-Chung Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/13 ; H01L23/00 ; H01L23/498 ; H01L25/065
Abstract:
A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°
Public/Granted literature
- US20210098330A1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-04-01
Information query
IPC分类:
