公开(公告)号：US20210098330A1

公开(公告)日：2021-04-01

申请号：US16805869

申请日：2020-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Der-Chyang Yeh ,  Shih-Peng Tai ,  Tsung-Shu Lin ,  Yi-Chung Huang

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498

Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°

公开(公告)号：US11289398B2

公开(公告)日：2022-03-29

申请号：US16805869

申请日：2020-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Der-Chyang Yeh ,  Shih-Peng Tai ,  Tsung-Shu Lin ,  Yi-Chung Huang

IPC: H01L23/367 ,  H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°