Invention Grant
- Patent Title: Perpendicular STTM multi-layer insert free layer
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Application No.: US16329309Application Date: 2016-09-30
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Publication No.: US11295884B2Publication Date: 2022-04-05
- Inventor: Kaan Oguz , Kevin P. O'Brien , Brian S. Doyle , Charles C. Kuo , Mark L. Doczy
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/054864 WO 20160930
- International Announcement: WO2018/063355 WO 20180405
- Main IPC: H01F10/32
- IPC: H01F10/32 ; H01L43/02 ; G11C11/16 ; H01L43/08 ; H01L43/10 ; H01L43/12

Abstract:
A perpendicular spin transfer torque memory (pSTTM) device incorporates a magnetic tunnel junction (MTJ) device having a free magnetic stack that includes a plurality of magnetic layers interleaved with a plurality of non-magnetic insert layers. The layers are arranged such that the topmost and bottommost layers are magnetic layers. The stacked design decreases the damping of the MTJ free magnetic stack, beneficially reducing the write current required to write to the pSTTM device. The stacked design further increases the interface anisotropy, thereby beneficially improving the stability of the pSTTM device. The non-magnetic interface layer may include tantalum, molybdenum, tungsten, hafnium, or iridium, or a binary alloy containing at least two of tantalum, molybdenum, tungsten hafnium, or iridium.
Public/Granted literature
- US20210296040A1 PERPENDICULAR STTM MULTI-LAYER INSERT FREE LAYER Public/Granted day:2021-09-23
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