Invention Grant
- Patent Title: LED module and method of fabricating the same
-
Application No.: US16901451Application Date: 2020-06-15
-
Publication No.: US11302745B2Publication Date: 2022-04-12
- Inventor: Jihye Yeon , Hanul Yoo , Jihoon Yun , Suhyun Jo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, PC
- Priority: KR10-2019-0135447 20191029
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/50 ; H01L33/32 ; H01L33/38 ; H01L33/46 ; H01L33/62 ; H01L25/18 ; H01L27/12 ; H01L33/00 ; H01L23/00

Abstract:
An LED module includes light emission windows; LED cells corresponding to the light emission windows, the LED cells each including a lower and upper light emitting structure, the lower light emitting structure having an upper surface with first and second regions and having a first conductivity-type semiconductor layer, the upper light emitting structure being on the first region of the lower light emitting structure and having a second conductivity-type semiconductor layer, the LED cells including an active layer between the first and second conductivity-type semiconductor layers; a protective insulating film on a side surface of the lower light emitting structure and on the second region; a light blocking film on the protective insulating film, between the LED cells; a gap-fill insulating film on the protective insulating film between the LED cells and contacting a side surface of the upper light emitting structure; a first electrode; and a second electrode.
Public/Granted literature
- US20210126045A1 LED MODULE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-04-29
Information query
IPC分类: