Invention Grant
- Patent Title: Package having different metal densities in different regions and manufacturing method thereof
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Application No.: US16929118Application Date: 2020-07-15
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Publication No.: US11309243B2Publication Date: 2022-04-19
- Inventor: Hsien-Wei Chen , Jie Chen , Ming-Fa Chen , Sen-Bor Jan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/00 ; H01L23/31 ; H01L21/56
Abstract:
A package has a first region and a second region. The package includes a first die, a second die, an encapsulant, and an inductor. The second die is stacked on and bonded to the first die. The encapsulant is aside the second die. At least a portion of the encapsulant is located in the second region. The inductor is located in the second region. A metal density in the first region is greater than a metal density in the second region.
Public/Granted literature
- US20210066192A1 PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-03-04
Information query
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