Invention Grant
- Patent Title: Polishing slurry composition enabling implementation of multi-selectivity
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Application No.: US17123115Application Date: 2020-12-16
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Publication No.: US11332641B2Publication Date: 2022-05-17
- Inventor: Gi Joo Shin , Jung Yoon Kim , Kwang Soo Park , Soo Wan Choi
- Applicant: KCTECH CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: KCTECH CO., LTD.
- Current Assignee: KCTECH CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: JCIPRNET
- Priority: KR10-2019-0170938 20191219
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14 ; H01L21/3105
Abstract:
A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.
Public/Granted literature
- US20210189178A1 POLISHING SLURRY COMPOSITION ENABLING IMPLEMENTATION OF MULTI-SELECTIVITY Public/Granted day:2021-06-24
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