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公开(公告)号:US11332641B2
公开(公告)日:2022-05-17
申请号:US17123115
申请日:2020-12-16
Applicant: KCTECH CO., LTD.
Inventor: Gi Joo Shin , Jung Yoon Kim , Kwang Soo Park , Soo Wan Choi
IPC: C09G1/02 , C09K3/14 , H01L21/3105
Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.
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公开(公告)号:US12247141B2
公开(公告)日:2025-03-11
申请号:US17415704
申请日:2019-11-04
Applicant: KCTECH CO., LTD.
Inventor: Nak Hyun Choi , Jung Yoon Kim , Hae Won Yang , Soo Wan Choi
IPC: C09G1/02 , C09G1/04 , B82Y40/00 , H01L21/304
Abstract: The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles.
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公开(公告)号:US12037516B2
公开(公告)日:2024-07-16
申请号:US17293236
申请日:2019-05-29
Applicant: KCTECH CO., LTD.
Inventor: Kwang Soo Park , Jun Ha Hwang , Soo Wan Choi , Nak Hyun Choi
Abstract: The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant including a nonionic linear polymer; and a second dispersant including an anionic coiling polymer, wherein the polishing slurry composition satisfies the following Expressions 1 and 2: [Expression 1] 4≤log(milling energy)
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