Invention Grant
- Patent Title: Memory devices and method of fabricating same
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Application No.: US16869780Application Date: 2020-05-08
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Publication No.: US11348935B2Publication Date: 2022-05-31
- Inventor: Chang-Ming Wu , Wei Cheng Wu , Shih-Chang Liu , Harry-Hak-Lay Chuang , Chia-Shiung Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil LLP
- Main IPC: H01L27/11568
- IPC: H01L27/11568 ; H01L29/792 ; H01L29/423 ; H01L21/311 ; H01L29/66

Abstract:
A device comprises a control gate structure and a memory gate structure over a substrate, a charge storage layer formed between the control gate structure and the memory gate structure, a first spacer along a sidewall of the memory gate structure, a second spacer along a sidewall of the control gate structure, an oxide layer over a top surface of the memory gate structure, a top spacer over the oxide layer, a first drain/source region formed in the substrate and adjacent to the memory gate structure and a second drain/source region formed in the substrate and adjacent to the control gate structure.
Public/Granted literature
- US20200266205A1 Memory Devices and Method of Fabricating Same Public/Granted day:2020-08-20
Information query
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