Invention Grant
- Patent Title: Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same
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Application No.: US15999169Application Date: 2018-08-17
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Publication No.: US11352707B2Publication Date: 2022-06-07
- Inventor: Seung Min Kim , An Na Lee , Ho Gun Kim , Shan Hua Jin
- Applicant: KCF Technologies Co., Ltd.
- Applicant Address: KR Anyang-si
- Assignee: KCF Technologies Co., Ltd.
- Current Assignee: KCF Technologies Co., Ltd.
- Current Assignee Address: KR Anyang-si
- Agency: K&L Gates LLP
- Priority: KR10-2017-0077658 20170620
- Main IPC: C25D1/04
- IPC: C25D1/04 ; C25D3/38 ; H05K1/09 ; H01M4/66 ; C25D7/06 ; C25D3/58 ; C25D5/00 ; H05K1/03 ; H05K3/02 ; H01M10/0525
Abstract:
Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
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