公开(公告)号：US11949110B2

公开(公告)日：2024-04-02

申请号：US16643773

申请日：2018-08-27

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  An Na Lee

IPC: H01M4/66 ,  C25D1/04 ,  C25D3/38 ,  C25D5/48 ,  H01M4/04 ,  H01M10/0525

CPC classification number: H01M4/661 ,  C25D1/04 ,  C25D3/38 ,  C25D5/48 ,  H01M4/0438 ,  H01M10/0525

Abstract: The present invention relates to a copper foil current collector having superior adhesion to an active material of a Li secondary battery. The electrolytic copper foil of the present invention having a first surface and a second surface comprises: a first protective layer at the first surface; a second protective layer at the second surface; and a copper film between the first and second protective layers, wherein an oxygen-containing part at the second surface has a thickness (OT) of not less than 1.5 nm. According to the present invention, an electrolytic copper foil current collector for a Li secondary battery, which has low electric resistance and high adhesion to an active material, can be provided.

公开(公告)号：US11352707B2

公开(公告)日：2022-06-07

申请号：US15999169

申请日：2018-08-17

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  An Na Lee ,  Ho Gun Kim ,  Shan Hua Jin

IPC: C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  H01M4/66 ,  C25D7/06 ,  C25D3/58 ,  C25D5/00 ,  H05K1/03 ,  H05K3/02 ,  H01M10/0525

Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra  [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.

公开(公告)号：US11505873B2

公开(公告)日：2022-11-22

申请号：US16631739

申请日：2018-07-25

Applicant: KCF Technologies Co., Ltd.

Inventor： Shan Hua Jin ,  An Na Lee ,  Seung Min Kim

IPC: C25D7/04 ,  C25D1/04 ,  C25D3/38 ,  C25D5/34 ,  C25D5/48 ,  H01M4/13 ,  H01M4/66 ,  H01M10/052 ,  B32B15/01

Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.