Invention Grant
- Patent Title: Chip package with emitter finger cells spaced by different spacings from a heat sink to provide reduced temperature variation
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Application No.: US16405325Application Date: 2019-05-07
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Publication No.: US11355409B2Publication Date: 2022-06-07
- Inventor: Hanyi Ding , Vibhor Jain , Alvin J. Joseph , Anthony K. Stamper
- Applicant: GlobalFoundries U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/367 ; H01L29/08 ; H01L21/48 ; H01L29/417 ; H01L29/732
Abstract:
Chip packages and methods of forming a chip package. The chip package includes a power amplifier and a thermal pathway structure configured to influence transport of heat energy. The power amplifier includes a first emitter finger and a second emitter finger having at least one parameter that is selected based upon proximity to the thermal pathway structure.
Public/Granted literature
- US20190267304A1 CHIP PACKAGES WITH REDUCED TEMPERATURE VARIATION Public/Granted day:2019-08-29
Information query
IPC分类:
