Invention Grant
- Patent Title: Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave
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Application No.: US16356316Application Date: 2019-03-18
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Publication No.: US11355838B2Publication Date: 2022-06-07
- Inventor: Ashutosh Baheti , Marwa Abdel-Aziz , Mustafa Dogan , Muhammad Tayyab Qureshi , Saverio Trotta , Maciej Wojnowski
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01Q13/10
- IPC: H01Q13/10 ; H01Q1/52 ; G01S7/03 ; G01S7/282 ; G01S7/285 ; G01S13/32 ; H01Q9/04 ; H01Q19/00
Abstract:
A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
Public/Granted literature
Information query
