Invention Grant
- Patent Title: Substrate transfer apparatus, substrate processing apparatus including the same, and substrate misalignment compensation method
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Application No.: US16430631Application Date: 2019-06-04
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Publication No.: US11380565B2Publication Date: 2022-07-05
- Inventor: Duk Sik Kim , Hyun Jun Kim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR10-2018-0066129 20180608
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; B65G47/90 ; H01L21/687 ; H01L21/68 ; B25J9/16 ; G05B19/401 ; G05B19/402
Abstract:
A substrate misalignment compensation method includes obtaining first coordinates for an amount of movement of a substrate transfer apparatus and second coordinates measured by a plurality of sensors installed on the substrate transfer apparatus while moving the substrate transfer apparatus in one direction, calculating a calibration value of the substrate transfer apparatus by using an equation of a circle for the first coordinates and an equation of a line for the second coordinates, and calculating the center of a circle for a substrate based on the calibration value of the substrate transfer apparatus and compensating for misalignment of the substrate by using the center of the circle.
Information query
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