公开(公告)号：US11380565B2

公开(公告)日：2022-07-05

申请号：US16430631

申请日：2019-06-04

Applicant: SEMES CO., LTD.

Inventor： Duk Sik Kim ,  Hyun Jun Kim

IPC: H01L21/67 ,  H01L21/677 ,  B65G47/90 ,  H01L21/687 ,  H01L21/68 ,  B25J9/16 ,  G05B19/401 ,  G05B19/402

Abstract: A substrate misalignment compensation method includes obtaining first coordinates for an amount of movement of a substrate transfer apparatus and second coordinates measured by a plurality of sensors installed on the substrate transfer apparatus while moving the substrate transfer apparatus in one direction, calculating a calibration value of the substrate transfer apparatus by using an equation of a circle for the first coordinates and an equation of a line for the second coordinates, and calculating the center of a circle for a substrate based on the calibration value of the substrate transfer apparatus and compensating for misalignment of the substrate by using the center of the circle.

公开(公告)号：US09966285B2

公开(公告)日：2018-05-08

申请号：US15161410

申请日：2016-05-23

Applicant: SEMES CO., LTD.

Inventor： Duk Sik Kim ,  Jun Ho You

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/681 ,  H01L21/68707

Abstract: Disclosed is a teaching method of setting a location of a robot that transports a substrate onto a rotatable support plate that supports the substrate, the teaching method including setting the location of the robot by using decentering values that are acquired by performing an operation of loading the substrate on the support plate with the robot, rotating the support plate by a preset angle, unloading the substrate from the support plate with the robot, and detecting a decentering value of the substrate positioned on a hand of the robot a plurality of times.

公开(公告)号：US10446429B2

公开(公告)日：2019-10-15

申请号：US15631192

申请日：2017-06-23

Applicant: SEMES CO., LTD.

Inventor： Duk Sik Kim

IPC: G06F19/00 ,  H01L21/68 ,  H01L21/677 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate treating apparatus comprises: an alignment unit for aligning a substrate placed in a support unit in position; and a teaching unit for setting a transfer position for transferring the substrate onto the support unit of the transfer unit, wherein the teaching unit correcting a transfer position of the transfer unit based on a difference value between a first position of a substrate placed on a hand of the transfer unit when the transfer unit is transferring the substrate and a second position of a substrate placed on the hand of the transfer unit that picks up the substrate aligned to the support unit in position.

公开(公告)号：US10388550B2

公开(公告)日：2019-08-20

申请号：US15274321

申请日：2016-09-23

Applicant: SEMES CO., LTD.

Inventor： Duk Sik Kim ,  Hyun Jun Kim

IPC: H01L21/67 ,  H01L23/544 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

Abstract: A method for detecting a center of substrate, for transporting a substrate, a substrate transporting unit, and a substrate treating apparatus are provided. The substrate center detecting method includes detecting four edge positions of the substrate, judging whether a notch exists among the four edge positions or not, moving the substrate when there is a notch among the four edge positions, and calculating a center of the substrate, wherein the calculating includes re-detecting four edge positions of the substrate, calculating a first midpoint of the substrate using three edge positions out of the four edge positions of the substrate detected in the detecting, calculating a second midpoint of the substrate using three edge positions out of the four edge positions of the substrate detected in the re-detecting, and determining a real midpoint of the substrate based on moving status of the first and second midpoints of the substrate.