Invention Grant
- Patent Title: Extending multichip package link off package
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Application No.: US17121534Application Date: 2020-12-14
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Publication No.: US11386033B2Publication Date: 2022-07-12
- Inventor: Debendra Das Sharma , Zuoguo Wu , Mahesh Wagh , Mohiuddin M. Mazumder , Venkatraman Iyer , Jeff C. Morriss
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/40
- IPC: G06F13/40 ; H01L25/065 ; G06F13/42 ; H01L23/538

Abstract:
An interconnect interface is provided to enable communication with an off-package device over a link including a plurality of lanes. Logic of the interconnect interface includes receiver logic to receive a valid signal from the off-package device on a dedicated valid lane of the link indicating that data is to arrive on a plurality of dedicated data lanes in the plurality of lanes, receive the data on the data lanes from the off-package device sampled based on arrival of the valid signal, and receive a stream signal from the off-package device on a dedicated stream lane in the plurality of lanes. The stream signal corresponds to the data and indicates a particular data type of the data. The particular data type can be one of a plurality of different data types capable of being received on the plurality of data lanes of the link.
Public/Granted literature
- US20210097015A1 EXTENDING MULTICHIP PACKAGE LINK OFF PACKAGE Public/Granted day:2021-04-01
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