Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16159839Application Date: 2018-10-15
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Publication No.: US11443938B2Publication Date: 2022-09-13
- Inventor: Boong Kim , Joo Jib Park , Woo Young Kim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR10-2017-0133730 20171016
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; B08B7/00 ; B08B3/08

Abstract:
A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a chamber having a first housing and a second housing that are combined with each other to form a processing space inside, and a housing actuator that moves the first housing to open or close the processing space. The housing actuator includes a plurality of cylinder units coupled to the first housing, a fluid supplier that supplies a fluid for operating the plurality of cylinder units, and a deviation corrector that corrects an operation deviation between the plurality of cylinder units. The deviation corrector corrects the operation deviation between the plurality of cylinder units coupled to the chamber, thereby minimizing particles that are generated when the chamber is opened/closed.
Public/Granted literature
- US20190115210A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2019-04-18
Information query
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