发明授权
- 专利标题： Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates
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申请号： US16142366申请日： 2018-09-26
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公开(公告)号： US11462457B2公开(公告)日： 2022-10-04
- 发明人: Krishna Vasanth Valavala , Kelly Lofgreen , Chandra-Mohan Jha
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt P.C.
- 主分类号： H01L23/38
- IPC分类号： H01L23/38 ; H01L21/48 ; H01L23/367 ; H01L25/065
摘要：
Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.
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