公开(公告)号：US11462457B2

公开(公告)日：2022-10-04

申请号：US16142366

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Krishna Vasanth Valavala ,  Kelly Lofgreen ,  Chandra-Mohan Jha

IPC: H01L23/38 ,  H01L21/48 ,  H01L23/367 ,  H01L25/065

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.