Invention Grant
- Patent Title: Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates
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Application No.: US16142366Application Date: 2018-09-26
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Publication No.: US11462457B2Publication Date: 2022-10-04
- Inventor: Krishna Vasanth Valavala , Kelly Lofgreen , Chandra-Mohan Jha
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/38
- IPC: H01L23/38 ; H01L21/48 ; H01L23/367 ; H01L25/065

Abstract:
Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.
Public/Granted literature
- US20200098664A1 USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-CONDUCTING PLATES Public/Granted day:2020-03-26
Information query
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