Invention Grant
- Patent Title: Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
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Application No.: US17011371Application Date: 2020-09-03
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Publication No.: US11466234B2Publication Date: 2022-10-11
- Inventor: Tsutomu Yoshino , Shogo Onishi , Yasuto Ishida
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu
- Agency: Foley & Lardner LLP
- Priority: JPJP2019-162883 20190906,JPJP2020-110739 20200626
- Main IPC: C11D3/37
- IPC: C11D3/37 ; C11D1/00 ; C11D11/00 ; H01L21/321 ; B08B3/08 ; H01L21/02 ; H01L21/3105 ; B08B1/00
Abstract:
To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon.
A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, in which, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, in which, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
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