- 专利标题: Semiconductor devices with layers commonly contacting fins and methods of manufacturing the same
-
申请号: US16388347申请日: 2019-04-18
-
公开(公告)号: US11469237B2公开(公告)日: 2022-10-11
- 发明人: Jin-Bum Kim , Myung-Gil Kang , Kang-Hun Moon , Cho-Eun Lee , Su-Jin Jung , Min-Hee Choi , Yang Xu , Dong-Suk Shin , Kwan-Heum Lee , Hoi-Sung Chung
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Myers Bigel, P.A.
- 优先权: KR10-2015-0163323 20151120
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L27/11 ; H01L29/66 ; H01L29/78 ; H01L23/485 ; H01L21/8234 ; H01L29/417 ; H01L23/528 ; H01L29/08 ; H01L29/161 ; H01L29/45 ; H01L27/092 ; H01L29/165
摘要:
A semiconductor device may include a first active fin, a plurality of second active fins, a first source/drain layer structure, and a second source/drain layer structure. The first active fin may be on a first region of a substrate. The second active fins may be on a second region of the substrate. The first and second gate structures may be on the first and second active fins, respectively. The first source/drain layer structure may be on a portion of the first active fin that is adjacent to the first gate structure. The second source/drain layer structure may commonly contact upper surfaces of the second active fins adjacent to the second gate structure. A top surface of the second source/drain layer structure may be further from the surface of the substrate than a top surface of the first source/drain layer structure is to the surface of the substrate.
公开/授权文献
信息查询
IPC分类: