- Patent Title: Method and device for forming metal gate electrodes for transistors
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Application No.: US17174990Application Date: 2021-02-12
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Publication No.: US11521858B2Publication Date: 2022-12-06
- Inventor: Huan-Chieh Su , Zhi-Chang Lin , Ting-Hung Hsu , Jia-Ni Yu , Wei-Hao Wu , Yu-Ming Lin , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L27/092 ; H01L29/51 ; H01L29/78 ; H01L21/8238 ; H01L29/66 ; H01L21/308

Abstract:
A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.
Public/Granted literature
- US20210167193A1 Method and Device for Forming Metal Gate Electrodes for Transistors Public/Granted day:2021-06-03
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