Invention Grant
- Patent Title: Semiconductor device and methods of forming same
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Application No.: US17240432Application Date: 2021-04-26
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Publication No.: US11522086B2Publication Date: 2022-12-06
- Inventor: Chih-Yu Ma , Shahaji B. More , Yi-Min Huang , Shih-Chieh Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L21/82 ; H01L29/78 ; H01L27/092 ; H01L21/8238

Abstract:
A device includes a fin extending from a substrate, a gate stack over and along sidewalls of the fin, a gate spacer along a sidewall of the gate stack, and an epitaxial source/drain region in the fin and adjacent the gate spacer. The epitaxial source/drain region includes a first epitaxial layer on the fin, the first epitaxial layer including silicon, germanium, and arsenic, and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer including silicon and phosphorus, the first epitaxial layer separating the second epitaxial layer from the fin. The epitaxial source/drain region further includes a third epitaxial layer on the second epitaxial layer, the third epitaxial layer including silicon, germanium, and phosphorus.
Public/Granted literature
- US20210257496A1 Semiconductor Device and Methods of Forming Same Public/Granted day:2021-08-19
Information query
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