Invention Grant
- Patent Title: Thermal management solutions for integrated circuit packages
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Application No.: US16244748Application Date: 2019-01-10
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Publication No.: US11545407B2Publication Date: 2023-01-03
- Inventor: Kumar Abhishek Singh , Omkar Karhade , Nitin Deshpande , Mitul Modi , Edvin Cetegen , Aastha Uppal , Debendra Mallik , Sanka Ganesan , Yiqun Bai , Jan Krajniak , Manish Dubey , Ravindranath Mahajan , Ram Viswanath , James C. Matayabas, Jr.
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34 ; H01L23/31 ; H01L23/00 ; H01L23/48 ; H01L21/56 ; H01L21/48

Abstract:
An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.
Public/Granted literature
- US20200227332A1 THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES Public/Granted day:2020-07-16
Information query
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